Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil
Removal of copper ion (Cu2+) by using
surfactant modified laterite (SML) was investigated in the present study.
Characterizations of laterite were examined by X-ray diffraction (XRD), Fourier
transforminfrared spectroscopy (FT-IR), inductively coupled plasma mass
spectrometry (ICP-MS), and total carbon analysis.
The optimum conditions for removal of
Cu2+ by adsorption using SMLwere systematically studied and found as pH 6,
contact time 90 min, adsorbent dosage 5mg/mL, and ionic strength 10mM NaCl.
The equilibrium concentration of
copper ions was measured by flame atomic absorption spectrometry (F-AAS).
Surface modification of laterite by
anionic surfactant sodium dodecyl sulfate (SDS) induced a significant increase
of the removal efficiency of Cu2+.
The surface modifications of laterite
by preadsorption of SDS and sequential adsorption of Cu2+ were also evaluated
by XRD and FT-IR.
The adsorption of Cu2+ onto SML
increases with increasing NaCl concentration from 1 to 10 mM, but at high salt
concentration this trend is reversed because desorption of SDS fromlaterite
surface was enhanced by increasing salt concentration.
Experimental results of Cu2+/SML
adsorption isotherms at different ionic strengths can be represented well by a
two-step adsorption model.
Based on adsorption isotherms,
surface charge effects, and surface modification, we suggest that the
adsorption mechanism of Cu2+ onto SML was induced by electrostatic attraction
between Cu2+ and the negatively charged SML surface and nonelectrostatic
interactions between Cu2+ and organic substances in the laterite.
| Title: | Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil |
| Authors: | Pham Tien Duc Nguyen Hoang Hiep Nguyen Ngoc Viet |
| Keywords: | FIXED-BED COLUMN HEAVY-METAL IONS WASTE-WATER MODIFIED-ALUMINA AQUEOUS-SOLUTION ALPHA-ALUMINA ENVIRONMENT CU(II) DYE NANOPARTICLES |
| Issue Date: | 2017 |
| Publisher: | HINDAWI LTD, ADAM HOUSE, 3RD FLR, 1 FITZROY SQ, LONDON, WIT 5HE, ENGLAND |
| Citation: | ISIKNOWLEDGE |
| Abstract: | Removal of copper ion (Cu2+) by using surfactant modified laterite (SML) was investigated in the present study. Characterizations of laterite were examined by X-ray diffraction (XRD), Fourier transforminfrared spectroscopy (FT-IR), inductively coupled plasma mass spectrometry (ICP-MS), and total carbon analysis. The optimum conditions for removal of Cu2+ by adsorption using SMLwere systematically studied and found as pH 6, contact time 90 min, adsorbent dosage 5mg/mL, and ionic strength 10mM NaCl. The equilibrium concentration of copper ions was measured by flame atomic absorption spectrometry (F-AAS). Surface modification of laterite by anionic surfactant sodium dodecyl sulfate (SDS) induced a significant increase of the removal efficiency of Cu2+. The surface modifications of laterite by preadsorption of SDS and sequential adsorption of Cu2+ were also evaluated by XRD and FT-IR. The adsorption of Cu2+ onto SML increases with increasing NaCl concentration from 1 to 10 mM, but at high salt concentration this trend is reversed because desorption of SDS fromlaterite surface was enhanced by increasing salt concentration. Experimental results of Cu2+/SML adsorption isotherms at different ionic strengths can be represented well by a two-step adsorption model. Based on adsorption isotherms, surface charge effects, and surface modification, we suggest that the adsorption mechanism of Cu2+ onto SML was induced by electrostatic attraction between Cu2+ and the negatively charged SML surface and nonelectrostatic interactions between Cu2+ and organic substances in the laterite. |
| Description: | TNS07018 ; JOURNAL OF CHEMISTRY Article Number: 1986071 Published: 2017 |
| URI: | http://repository.vnu.edu.vn/handle/VNU_123/28872 |
| ISSN: | 2090-9063 2090-9063 |
| Appears in Collections: | Bài báo của ĐHQGHN trong Web of Science |
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